PROCESSING SERVIECE
Comprehensive services
Quality Commitment and Delivery Guarantee
Stable Quality Assurance
ISO 9001 certification system ensures that every board meets customer specifications, with defect rates controlled at an industry-leading level.
Fast Delivery Commitment
Standard delivery time is 2 working days; urgent orders can be processed 24 hours a day to help customers seize market opportunities.
Technical Support Services
Providing pre-production engineering consultation and process parameter optimization suggestions to help customers improve product yield and reduce production costs.
Choosing Qiaogongjiang means choosing professionalism, efficiency, and trust
Process Capability Specifications
Completely covers production needs from small sizes to large boards, from thin boards to thick boards
| Item | In-plant Capability Specifications |
|---|---|
| Substrate Size Range | |
| Upper limit of plate thickness | 10mm (High thickness plate processing capacity) |
| Production plate thickness | |
| Plate bending and warping control | Plate thickness <3mm: <6mm / Plate thickness 3.1~4mm: <5mm / Plate thickness 4.1~5mm: <4mm / Plate thickness >5mm: <3mm |
| Through-hole plug diameter | 0.08mm ~ 30mm (after electroplating) |
| Blind-hole plug diameter | 0.05mm ~ 10mm (after electroplating) |
| Back-drilled hole plug diameter | 0.1mm ~ 0.65mm |
| Through-hole diameter variation | Maximum - Minimum < 0.45mm (within a single tool set) |
| Through-hole depth ratio (AR) | Sample 80:1 / Production 50:1 |
| Blind via depth ratio (AR) | Sample 12:1 / Production 10:1 |
| Plated and unplated via spacing | Before aperture compensation: 0.3mm |
| Plated via recess depth | 0μm (Perfectly flat surface) |
| Copper reduction through grinding | Oil output ≤200μm: <10μm / Oil output 200~300μm: 11~20μm (sufficient corner copper required) |
| Grinding roughness | RT < 5μm (ultra-smooth surface treatment) |
**Technical Advantages:** Our process capabilities cover the most stringent specifications in the industry, consistently achieving high aspect ratio fine hole plugging, ultra-low copper reduction precision grinding, and perfect zero-dimple surface treatment. These capabilities stem from years of technological accumulation and continuous equipment optimization. | |