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Ceramic Brush

Ceramic Brush

Application:
·Remove permanent hole plugging ink
·Leveling build-up resin/prepreg resin after IVH/BVH process
·Reduce copper thickness/residual copper dust after plating
·Remove oxided layer
·Deburr after drilling
·Remove PP resin on SUS laminate

Base Materials

Ceramic Cubic · XI pipe · Rubber pipe · Sponge · GSH Know-How Adhesives

Features

Cutting force: High/middle/low cutting force

Types: High uniformity/high adhesion/common type

No particle remains in holes

Uniform surface after scrubbing

Replaces sand belt

Technical parameters
Grit320#400#600#800#1000#1200#1500#2000#2500#
Abrasive
SIC/AO
Size
OD162/150/140/127/70*ID76.2/50.8/25.4*L120/610/710/1100mm
Ceramic Cubic
L*W*H=8*8*12mm,9*9*12mm,11*11*8mm,11*11*9mm,11*11*12mm,13*13*12mm

 

Example
Application
Remove plugged ink/reduce copper/remove copper dust after electro-plating
Brush Combination
GSH CRBA600#*6+GSH CRBB800#*2
Machines(GSH)MAB4G(GSH) MAB4N(GSH)MAB4A
Conditions
1.5A, 2.5m/min
Features
· No damage to holes · No impress to thin PCB (T<0.3mm) · Uniformly cutting

 


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